Polishing pad of a polyurethane of propane diol

摘要

This invention is directed to a polishing pad for chemical mechanical polishing of substrates, for example, the surface of electrical devices such as semiconductors or other substrates; wherein the pad comprises a polyurethane that is the reaction product of an organic polyisocyanate and 1,3 propane diol; preferably, the pad has a porous structure and more preferably has a microporous structure.