发明名称 LEADFRAME HAVING JOINED INTERNAL LEAD
摘要 A type of leadframe having a joined internal lead. A leadframe includes a plurality of adhesion pads and a plurality of leads. The leads are arranged around the adhesion pads. The adhesion pads are formed by joining some extended leads. The adhesion leads replace the conventional die pad to support and attach a chip.
申请公布号 US2001050420(A1) 申请公布日期 2001.12.13
申请号 US19990231538 申请日期 1999.01.14
申请人 YANG TE-SHENG 发明人 YANG TE-SHENG
分类号 H01L23/495;(IPC1-7):H01L23/495 主分类号 H01L23/495
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