Method for finding faulty tools in semiconductor fabrication facility, requires drawing up batch list for each tool and assigning weighted value for each batch

摘要

A method of finding a defective tool in a semiconductor manufacturing device having a number of tools for processing a number of semiconductor wafers involves carrying out a series of wafer processing steps on the wafers with a number of tools, and then generating a data bank and carrying out tests on the wafers to determine whether the wafer is associated with a fault signature. A batch-list is then drawn up for each tool, and a weighted value for each batch in the list is assigned. An cumulative value for each tool is then generated by sequentially adding the weighted values of each single batch of the list of batches.