发明名称 |
PRINTED CIRCUIT HEAT SINK AND METHODS FOR MAKING SAME |
摘要 |
The invention concerns a printed circuit heat sink, characterised in that it comprises a metal matrix (3) and a plurality of ceramic particles (1) distributed substantially homogeneously in the metal matrix. The invention also concerns three methods for making said heat sink. |
申请公布号 |
WO0195393(A1) |
申请公布日期 |
2001.12.13 |
申请号 |
WO2001FR01755 |
申请日期 |
2001.06.07 |
申请人 |
CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE;SILVAIN, JEAN-FRANCOIS, PIERRE |
发明人 |
SILVAIN, JEAN-FRANCOIS, PIERRE |
分类号 |
H01L23/373;(IPC1-7):H01L23/373 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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