发明名称 PRINTED CIRCUIT HEAT SINK AND METHODS FOR MAKING SAME
摘要 The invention concerns a printed circuit heat sink, characterised in that it comprises a metal matrix (3) and a plurality of ceramic particles (1) distributed substantially homogeneously in the metal matrix. The invention also concerns three methods for making said heat sink.
申请公布号 WO0195393(A1) 申请公布日期 2001.12.13
申请号 WO2001FR01755 申请日期 2001.06.07
申请人 CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE;SILVAIN, JEAN-FRANCOIS, PIERRE 发明人 SILVAIN, JEAN-FRANCOIS, PIERRE
分类号 H01L23/373;(IPC1-7):H01L23/373 主分类号 H01L23/373
代理机构 代理人
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