发明名称 Injection molding of ceramic powders using non-gel forming water soluble organic binders
摘要 A method for compounding gel-free injection molding feed stock for injection molding net-shape ceramic parts, including the steps of: mixing inorganic particles with non-gel forming water soluble organic binders having molecular weight between 1000 and 1,000,000 and that are between 0.5 weight % and 10 weight % based upon the inorganic particles, along with plasticizers, water and processing aids in a mixer to form a mixture, wherein the non-gel forming water soluble organic binders are composed of high and low molecular weight organic binders; compounding the mixed inorganic particles and the non-gel forming water soluble organic binders at a high temperature in the range of between 70° and 98° Centigrade, under shear force, to form a homogenous viscous slurry in the range of 5x103 and 7x104 Pa. sec at a shear rate of 10 sec-1; cooling the homogenous viscous slurry to room temperature to form a compounded solid mass.
申请公布号 US2001050451(A1) 申请公布日期 2001.12.13
申请号 US20010916860 申请日期 2001.07.27
申请人 EASTMAN KODAK COMPANY 发明人 GHOSH SYAMAL K.;CARLTON DONN B.
分类号 A61B5/029;A61B5/083;A61B5/097;A61M16/00;A61M16/20;(IPC1-7):B29C45/00 主分类号 A61B5/029
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