| 摘要 |
According to the method of processing in accordance with the present invention, first, a beam area formed by a laser beam on the organic insulating film is set to be larger than an area formed by projecting a target part of an organic insulating film onto a horizontal plane, subsequently, the organic insulating film is moved toward the irradiated region of the laser beam, and the irradiation with the laser beam is terminated when the end part of the target part coincides with the moving end part of the laser beam. This enables the resultant processed target surface to be smooth and free from reaction product including decomposed segments of the target body.
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