发明名称 |
INTEGRATED CIRCUIT PACKAGE |
摘要 |
An integrated circuit package is provided that includes a multi-layer organic substrate. The substrate has conductive vias provided between isolated conductive layers. The vias are formed using a laser to cut through a dielectric layer separating the conductive layers. External interconnects in the form of T-shaped pins are soldered to the substrate of the integrated circuit package. An integrated circuit can be attached to the substrate using a flip-chip technique. |
申请公布号 |
WO0141212(A3) |
申请公布日期 |
2001.12.13 |
申请号 |
WO2000US32904 |
申请日期 |
2000.12.04 |
申请人 |
INTEL CORPORATION |
发明人 |
SANKMAN, BOB;AZIMI, HAMID |
分类号 |
H01L23/12;H01L21/48;H01L23/498;H05K3/34;H05K3/46 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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