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发明名称
INEXPENSIVE ELECTRONIC PACKAGING METHOD USING MELTING METAL BRIDGE CONNECTION METHOD
摘要
申请公布号
KR20010110570(A)
申请公布日期
2001.12.13
申请号
KR20000031113
申请日期
2000.06.07
申请人
BANG, HEA JUNG;CHOE, SEONG HO;HWANG, JUNG SUK
发明人
BANG, HEA JUNG;CHOE, SEONG HO;HWANG, JUNG SUK
分类号
(IPC1-7):H01L23/28
主分类号
(IPC1-7):H01L23/28
代理机构
代理人
主权项
地址
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