发明名称 CONDUCTIVE COMPOSITION, METHOD FOR MANUFACTURING ELECTRODE OR PRINTED BOARD COMPRISING THE SAME, METHOD FOR CONNECTING ELECTRODE COMPRISING THE SAME, AND ELECTRODE OR PRINTED BOARD USING THE SAME
摘要 <p>A conductive composition contributing to improvement of the manufacturing efficiency at the step of interconnecting electrodes and reduction of the fraction defective, an electrode or printed board comprising the same, a method for connecting an electrode comprising the same, and an electrode or printed board using the same. A conductive composition (40) contains a photo-curing component and a conductive material (41) and has a conductivity of 10-4 S/m or more after the curing by light irradiation.</p>
申请公布号 WO2001095343(P1) 申请公布日期 2001.12.13
申请号 JP2001004613 申请日期 2001.05.31
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