发明名称 |
METHODS FOR FORMING ROUGH RUTHENIUM-CONTAINING LAYERS AND STRUCTURES/METHODS USING SAME |
摘要 |
A method for forming a rough ruthenium-containing layer on the surface of a substrate assembly includes providing a ruthenium-containing precursor into the reaction chamber. A rough ruthenium layer may be deposited on the surface of the substrate assembly at a rate of about 100 ANGSTROM /minute to about 500 ANGSTROM /minute using the ruthenium-containing precursor. Further, a rough ruthenium oxide layer may be formed by providing a ruthenium-containing precursor and an oxygen-containing precursor into the reaction chamber to deposit the rough ruthenium oxide layer on the surface of the substrate assembly at a rate of about 100 ANGSTROM /minute to about 1200 ANGSTROM /minute. An anneal of the layers may be performed to further increase the roughness. In addition, conductive structures including a rough ruthenium layer or a rough ruthenium oxide layer are provided. Such layers may be used in conjunction with non-rough ruthenium and/or non-rough ruthenium oxide layers to form conductive structures. For example, such structures may be part of a capacitor structure, e.g., bottom electrode of a capacitor. |
申请公布号 |
WO0195376(A2) |
申请公布日期 |
2001.12.13 |
申请号 |
WO2001US40867 |
申请日期 |
2001.06.07 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
DERDERIAN, GARO;AGARWAL, VISHNU, K. |
分类号 |
C23C16/18;C23C16/52;H01L21/02;H01L21/20;H01L21/28;H01L21/285;H01L21/8242;H01L27/108 |
主分类号 |
C23C16/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|