发明名称 |
Mounting apparatus and mounting method |
摘要 |
A mounting apparatus includes: a heater head for bonding a liquid crystal display and a flexible printed circuit board by thermocompression; a cylinder as a heater head driving means for driving heater head to compress the liquid crystal display and flexible printed circuit board by a prescribed load; and a control mechanism as a stretch amount controlling means for adjusting a load change per unit of time after the heater head starts compressing the flexible printed circuit board by the cylinder as well as a time at which a required load is attained to control the stretch amount of the flexible printed circuit board by thermocompression. Preferably, the mounting apparatus is provided with a mechanism which performs measurement after preliminary bonding and which performs regular bonding while controlling based on the obtained information.
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申请公布号 |
US2001051840(A1) |
申请公布日期 |
2001.12.13 |
申请号 |
US20010865726 |
申请日期 |
2001.05.29 |
申请人 |
SUGIMOTO SHINICHI;NAGATA KATSUNORI;OOGA MASAAKI;NAKAGAWA TOSHIHIKO |
发明人 |
SUGIMOTO SHINICHI;NAGATA KATSUNORI;OOGA MASAAKI;NAKAGAWA TOSHIHIKO |
分类号 |
G02F1/1345;G02F1/13;H01R43/02;H05K1/02;H05K3/34;H05K3/36;(IPC1-7):G06F19/00;G09G5/00 |
主分类号 |
G02F1/1345 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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