Semiconductor device and a method of manufacturing the same

摘要

The present invention provides a semiconductor device which is stably operated even with respect to heat generated upon its operation and makes no use of an environmental harmful substance (lead). The semiconductor device includes a support plate for supporting a semiconductor chip and the semiconductor chip fixed onto the support plate with an adhesive interposed therebetween. The semiconductor chip is fixed to the support plate by a highly thermal conductive adhesive and a high junction strength adhesive provided so as to separate bonding areas from one another. The highly thermal conductive adhesive is provided in plural places within the whole fixing area. The highly thermal conductive adhesive is associated with a heated portion of the semiconductor chip. The high junction strength adhesive is provided so as to surround the highly thermal conductive adhesive. Both the adhesives do not contain lead corresponding to the environmental harmful substance.