| 发明名称 |
Electronic assembly with high density of electrical interconnections |
| 摘要 |
The electronic assembly has a first electronic integrated module (1) providing interconnections and connected to a printed circuit board (35). There is a base section and heat removal means (3,12). The base and interconnections are independent. |
| 申请公布号 |
EP1162660(A1) |
申请公布日期 |
2001.12.12 |
| 申请号 |
EP20010401320 |
申请日期 |
2001.05.21 |
| 申请人 |
ALCATEL |
发明人 |
VENDIER, OLIVIER;HUAN, MARC;PAINEAU, SYLVAIN |
| 分类号 |
H01R12/24;H01L23/36;H01L23/427;H01R13/46;H05K1/14;H05K1/18;H05K7/20 |
主分类号 |
H01R12/24 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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