发明名称 PCB formation by laser cleaning of conductive ink
摘要 There is disclosed a method of forming conductive tracks on a substrate using a laser ablation technique in order to produce Printed Circuit Boards (PCBs). The method involves the initial step of coating a substrate such as alumina substrate with a conductive ink to create a conductive ink layer. Subsequent to this, a laser spot is focussed onto the ink in order to ablate a portion of the ink layer from the substrate to define tracks of ink, which are then cured. Also disclosed is a method of forming multiple layers of conductive tracks on a substrate, each layer of conductive tracks being separated by a layer of cured dielectric ink. The method involves and sequentially coating, ablating, and curing alternate dielectric and conductive ink layers on a substrate incorporating cured tracks of ink produced by the method noted above. An apparatus for use in the method is also disclosed.
申请公布号 GB0125350(D0) 申请公布日期 2001.12.12
申请号 GB20010025350 申请日期 2001.10.22
申请人 SIGTRONICS LIMITED 发明人
分类号 H01L21/48;H05K3/02;H05K3/46 主分类号 H01L21/48
代理机构 代理人
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