Infrared sensing element and temperature measuring device

摘要

An infrared sensing element of the present invention includes a base including a thin film portion and a thick wall portion arranged around the thin film portion, and a thermopile including a plurality of thermocouples connected in series so that cold junctions are located on the thick wall portion, and hot junctions are located on the thin film portion, wherein a thermosensitive portion is provided in contact with the thick wall portion so that a reference temperature with high accuracy can be used for determining temperature based on output from the thermopile. As the thermosensitive portion, a PN junction formed on a semiconductor substrate is used to provide a compact infrared sensing element with high performance at low cost. <IMAGE>