发明名称 |
LEADFRAME FOR THE ASSEMBLY OF AN INTEGRATED CIRCUIT IN AN INJECTION MOUNDED HOUSING |
摘要 |
The lead frame has a spring element, which can be compressed during the injection molding of the package by an injection mold. The resultant resilience has the effect that a contact surface of the lead is pressed against an inside wall of the injection mold. The biasing of the contact surface against the inside wall prevents polymer flash from forming on the contact surface. Also, the spring element fixes the lead during the injection operation and anchors the lead in the completed package. Hold-down pins within the injection mold are thus obviated. |
申请公布号 |
EP0907928(B1) |
申请公布日期 |
2001.12.12 |
申请号 |
EP19970931650 |
申请日期 |
1997.06.24 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
HAUSER, CHRISTIAN;SCHMIDT, HELGE;WINDERL, JOHANN |
分类号 |
H01L23/00;G06K19/077 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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