发明名称 |
Surface-acoustic wave device package |
摘要 |
A surface-acoustic-wave device package includes a cover film which covers a piezoelectric substrate to provide an air gap around the functional surface of the surface-acoustic-wave device. The surface-acoustic-wave device package also includes a seal material which is provided over the cover film to seal the surface-acoustic-wave device.
|
申请公布号 |
US6329739(B1) |
申请公布日期 |
2001.12.11 |
申请号 |
US19990302422 |
申请日期 |
1999.04.30 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
SAWANO MASAYUKI |
分类号 |
H03H9/10;(IPC1-7):H01L41/04 |
主分类号 |
H03H9/10 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|