发明名称 Surface-acoustic wave device package
摘要 A surface-acoustic-wave device package includes a cover film which covers a piezoelectric substrate to provide an air gap around the functional surface of the surface-acoustic-wave device. The surface-acoustic-wave device package also includes a seal material which is provided over the cover film to seal the surface-acoustic-wave device.
申请公布号 US6329739(B1) 申请公布日期 2001.12.11
申请号 US19990302422 申请日期 1999.04.30
申请人 OKI ELECTRIC INDUSTRY CO., LTD. 发明人 SAWANO MASAYUKI
分类号 H03H9/10;(IPC1-7):H01L41/04 主分类号 H03H9/10
代理机构 代理人
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