发明名称 Curable composite material composition and curing process therefor
摘要 A curable composite material composition comprising(A) a polymerizable unsaturated compound,(B) a fiber reinforcing material and/or fiber, and(C) a polymerization initiator comprising an organic boron compound represented by the general formula (1) wherein R1, R2, R3 and R4 each independently represent an alkyl, aryl, allyl, aralkyl, alkenyl, alkynyl, silyl or heterocyclic group, a halogen atom, or a substituted alkyl, substituted aryl, substituted allyl, substituted aralkyl, substituted alkenyl, substituted alkynyl or substituted silyl group, and Z+ represents a cation, and an acidic compound, as well as a curing process for the curable composite material composition which includes irradiating and/or heating the curable composite material composition.
申请公布号 US6329442(B1) 申请公布日期 2001.12.11
申请号 US20000708463 申请日期 2000.11.09
申请人 SHOWA DENKO K.K.;SHOWA HIGHPOLYMER CO., LTD. 发明人 SUGITA SHUICHI;KAMATA HIROTOSHI;YAMAMOTO TOMIO;OHTANI KAZUO;SENDAI HIDETAKE
分类号 C08L101/00;C08F2/50;C08F4/12;C08F4/40;C08F4/44;C08F4/52;C08F283/01;C08F290/06;C08F299/00;C08F299/04;C08J5/24;(IPC1-7):C08F2/50 主分类号 C08L101/00
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