PHOTORESIST COMPOSITION FOR THREE-DIMENSIONAL PHOTO- FORMING

摘要

PROBLEM TO BE SOLVED: To provide a photosetting resin composition capable of giving three- dimensional photo-molded form having an overhang part or another complex shape with ease by using only photosetting resin composition without arranging a separate support member in a molding bath nor integrally molding a supporting part in the form. SOLUTION: This photosetting resin composition for three-dimensional photo- molding is characterized by comprising (a) a polymerizable compound composed of at least one selected from radical-polymerizable compounds and cationically polymerizable compounds and (b) a photoinitiator and having 20-90 deg.C melting temperature.