Method of analyzing visual inspection image data to find defects on a device

摘要

A method for analyzing image data is disclosed that will find defects on a multi-layer device having solder pads, such as a semiconductor computer chip. The method provides a device template image, a theoretical image created from data from several real images, for comparison to an image of a device to be tested after the solder pad data is segmented. The parameter values of the device to be tested are recorded and compared to the parameter values of the device template, forming a difference image. The difference image and the solder pad data are then run through a series of tests, wherein the device is determined defective or not defective.