System for welding a package of layers and sheets of pre-preg, in a hot press, to form an electronic multi-layer printed circuit

摘要

System for peripheral welding of packages (40) consisting of layers (41) for making multi-layer printed circuits by means of pairs of electrodes (51, 61) with opposing welding tips (70, 71) characterized by the presence in the layers (41), at the position of said tips, of coaxial holes (46-48) of the same diameter, and by the fact that, during welding, the area around said holes (46-48) is held firm by the opposing plates (76, 77) of a small press (75-79).