发明名称 Method of patterning organic polymer film and method for fabricating semiconductor device
摘要 An organic polymer film patterning method includes the steps of: defining a resist film on a selected area of a substrate; depositing an organic polymer film over the substrate by a plasma CVD process so that the resist film is covered with part of the organic polymer film; and removing the resist film along with the part of the organic polymer film that has covered the resist film.
申请公布号 US6329227(B2) 申请公布日期 2001.12.11
申请号 US20010789738 申请日期 2001.02.22
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 ANDA YOSHIHARU;NISHITSUJI MITSURU;KAWASHIMA KATSUHIKO;TANAKA TSUYOSHI
分类号 H01L21/285;H01L21/308;H01L21/311;H01L21/312;(IPC1-7):H01L21/00;H01L21/84 主分类号 H01L21/285
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