发明名称 RESIN MOLDED HOUSING PART FOR ELECTRONIC MACHINERY
摘要 PROBLEM TO BE SOLVED: To provide a technique for strongly bonding materials laminated to be combined with each other in a resin molded housing part for electronic machinery formed by combining a plurality of materials to mold them. SOLUTION: In the resin molded housing part for electronic machinery formed by laminating a plurality of different materials to combine them with each other, the wall thicknesses of the materials laminated to be combined with each other are mutually varied to perform molding.
申请公布号 JP2001341213(A) 申请公布日期 2001.12.11
申请号 JP20000163983 申请日期 2000.06.01
申请人 PFU LTD 发明人 HANAMOTO EIJI
分类号 H05K5/02;B32B1/04;(IPC1-7):B32B1/04 主分类号 H05K5/02
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