| 摘要 |
An optical modulator that modulates light through the semiconductor substrate through the back side of a flip chip packaged integrated circuit. The optical modulator of the present invention enables integrated circuit signals to be extracted through the back side of the semiconductor substrate. In one embodiment, an optical modulator is disposed within a flip chip packaged integrated circuit die. The optical modulator includes a deflector and a diffraction grating. An infrared light beam is directed through the back side of a silicon substrate of the integrated circuit die, deflected off the deflector through the diffraction grating and back out the back side of the integrated circuit die. The diffraction grating modulates the phase of a portion of the deflected light beam in response to an integrated circuit signal. A resulting diffraction interference occurs between the phase modulated portions and nonphase modulated portions of the deflected light beam. The interference causes amplitude modulation of a zero order diffraction of the deflected light beam, from which the integrated circuit signal can be extracted. The zero order diffraction is allowed to pass through an optical passage to exit the semiconductor substrate of the flip chip packaged integrated circuit die while the non-zero order diffractions are blocked.
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