Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and method of designing and fabricating such leadframes

摘要

A leadframe including offsets extending from a major plane thereof. The offsets extend from the major plane at a non-perpendicular angle thereto. Preferably, the angle of extension, relative to the major plane, is about 45 degrees or less. The offsets may extend upwardly and/or downwardly from the major plane. The offsets of the present invention are useful for preventing warpage, bowing, skewing, or other distortions of a packaged semiconductor device including same when subjected to high Temperatures or changes in temperature.