发明名称 |
Process for exposing for analysis the back side of a semiconductor die mounted in a package |
摘要 |
A method for preparing for analysis the back side of a die in a package. The method comprises removing a selected portion of the package, whereby a selected area of the die is exposed and a cavity is formed in the package. Thereafter, a selected portion the die at the exposed area is removed. In a final phase, the exposed surface of the die is polished.
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申请公布号 |
US6329212(B1) |
申请公布日期 |
2001.12.11 |
申请号 |
US19990227599 |
申请日期 |
1999.01.08 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
DOBROVOLSKI MICHAEL |
分类号 |
G01R31/311;G01R31/316;(IPC1-7):G01R31/26 |
主分类号 |
G01R31/311 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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