| 摘要 |
A method for precision cutting liquid soluble scintillator materials by an operator is disclosed, including the steps of providing a first run of a moving filament in operative proximity to cut the scintillator materials, concurrent with wetting at least the first run length of the moving filament with organic solvent, and engaging the wetted first run with the soluble scintillator materials for a time sufficient to create a kerf having cut surfaces with solvent thereon, with the kerf cut surfaces dissolved to reshape the kerf corners, and without the formation of surface hydrates. The wetting step is accompanied by providing a second run of the wetted filament in a reverse direction and engaging the scintillator materials. The first run and second run engaging steps are concurrent with tensioning the moving filament, producing kerfs through the scintillator materials, with organic solvent delivered onto kerf surfaces. The organic solvent, such as alcohol or organic-based solvent, dissolves the kerf surfaces and contiguous materials, softening the surfaces and producing precisely cut kerfs with gently radiused corners. Repetitive dicing, slitting, slotting and otherwise segmenting of the scintillator materials with the wetted moving filament creates precisely cut subunit scintillator materials with gently radiused corners. The method produces extremely precise kerfs in soluble scintillator materials with kerfs having gently radiused corners that are resistance to stress fractures, breakage, and cleavage during production and use of the scintillator materials.
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