| 摘要 |
PROBLEM TO BE SOLVED: To obtain an episulfide compound excellent in terms of workability, processability and physical properties, suitable for sealing a lamp, a semiconductor chip, etc., besides use for an adhesive and a laminate material, a curable composition containing the compound and a cured material of the composition. SOLUTION: This episulfide compound contains at least one or more alicyclic skeletons and at least two or more oxirane rings or thiirane rings, in which one or more are thiirane rings, in the molecule. This curable composition contains the episulfide compound. This cured material is obtained by curing the composition.
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