发明名称 SOCKET FOR LAND GRID ARRAY PACKAGE
摘要 <p>PROBLEM TO BE SOLVED: To provide a socket for a land grid array(LGA) package, capable of decreasing inductance of a terminal and lowering its height. SOLUTION: The terminal 40 is composed of a first terminal 41, having a tail 44 projecting from the bottom of a housing 20 and a second terminal 42, having a contact 43 projecting from the surface of a terminal mounting part 21. The first terminal 41 has an almost V-shaped spring part 49, the second terminal 42 has an almost V-shaped movement 52, capable of fitting to the inside of the spring part 49. An almost V-shaped movement 52 of the second terminal 42 is fit to the inside of the almost V-shaped spring part 49 of the first terminal 41, a current conducting passage is formed on one side of the V-shaped, and an elasticity mechanism for energizing the contact on the other side is formed.</p>
申请公布号 JP2001338740(A) 申请公布日期 2001.12.07
申请号 JP20000154863 申请日期 2000.05.25
申请人 MOLEX INC 发明人 NODA ATSUTO
分类号 H01R33/76;(IPC1-7):H01R33/76 主分类号 H01R33/76
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