| 摘要 |
PROBLEM TO BE SOLVED: To solder-bond leads of an electronic component with nearly a constant quantity of solder. SOLUTION: A method of manufacturing a mount substrate for manufacturing a mount substrate by inserting the leads of the electronic component with leads into lead insertion holes of a single-sided mount substrate having no through holes and then soldering the leads. This method comprises a process of attaching a solder paste 8a having holes larger than the inner diameter of the lead insertion holes 3a to soldering lands 2a having holes the diameter, of which is nearly the same as that of the lead insertion holes so that the centers of the holes of the solder paste may be almost alligned with those of the holes of the soldering lands; a process of inserting the leads 12a of the electronic component into the lead insertion holes 3a; and a process of heating the solder paste by reflowing and then soldering the leads 12a of the electronic component to the soldering lands 2a.
|
