| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a product of superior quality surely and safely carrying out a resin sealing operation using a resin sealing apparatus with an intermediate die, and to allow the resin sealing apparatus to be preferably automated. SOLUTION: In a resin sealing apparatus of a semiconductor device comprising an upper die 10 and a lower die 12 that are movably supported in a die opening and closing direction by a press apparatus and the intermediate die 14 arranged between them, and filling a cavity 42 with resin for resin sealing via the intermediate die 14 from a pot 16, the intermediate die 14 is installed so as to be freely advanced/retreated between the resin sealing position which is arranged between the upper die 10 and the lower die 12 and where a sealed product is sealed with the resin and a retreated position that is at the side position of the upper die and the lower die and where the upper die and the lower die are not interfered.
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