| 摘要 |
PROBLEM TO BE SOLVED: To prevent a chip capacitor from tilting after soldering due to one- sided solder at the time of soldering the capacitor. SOLUTION: The soldering surfaces 53 and 73 of plurality of cathode terminals and anode terminals are respectively provided at intervals in the same flat surface of a chip capacitor. Since the soldering surfaces 53 and 73 are formed separately, solder is scattered without leaning at the time of soldering the capacitor to lands provided on a printed wiring board. Therefore, the inclined mounting of the chip capacitor on the board can be suppressed and, at the same time, the occurrence of defective soldering, etc., can also be prevented.
|
