| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treatment with high productivity by performing plasma heating in a surface treating method in which plural substrates are simultaneously treated, and a system therefor. SOLUTION: In this surface treating method and system in which plural substrates 1 are placed on a substrate supporting stand 2, plasma is generated onto the circumferences of the substrates 1 by a plasma source 6, and further, bias voltage is applied on the substrates 1 by a bias power source 21, by which the surfaces of the substrates 1 are subjected to surface treatment such as etching, doping and film deposition, magnets 30 are buried in the substrate supporting stand 2 to form the magnetic fields 50 on the spaces among the plural substrates 1, 1 and, at the time of the plasma heating, charged particles are concentrated on the substrates 1 to efficiently heat the substrates 1. |
