| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit unit that is suitably miniaturized and has excellent electrostatic countermeasures. SOLUTION: On an aluminum substrate 1, circuit elements including capacitors C1 to C7, resistors R1 to R3, inductance elements L1 to L3, and the like, and a conductive pattern P that is connected to the circuit elements are formed in a thin film. At the same time, on the aluminum substrate 1, the semiconductor bare chips of a diode D1 and a transistor Tr1 are wire- bonded. In addition, a proximity part G for discharge is provided in a conductive pattern P for connecting electrodes (Vcc and Vctl) for input and an electrode (RFout) for output at the end of the aluminum substrate 1 to the capacitors C2 and C7. |
