| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which is improved in yield and possessed of via conductors improved in connection reliability, and a method of manufacturing the same. SOLUTION: A wiring board 1 is equipped with primary surface side connection terminals 41 which are exposed on its primary surface 2 to be connected to the connection terminals 83 of an IC chip 81 mounted on the primary surface 2, and rear surface side connection terminals 49. A primary surface side first via conductor 29 is formed in a primary surface first through-hole 27 bored in the primary surface side first insulating layer 11 to serve as the primary surface connection terminal 41, and a rear surface side via conductor 45 is formed in a rear surface first through-hole 43 bored in a rear surface first insulating layer 15 and connected to the rear surface side connection terminals 49. The rear surface side first through-hole 43 is larger in diameter than the primary surface first through-hole 27. |
