| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mounting electronic circuit unit with a shield cover which is appropriate for downsizing and is easy to manufacture. SOLUTION: A circuit element 3 such as resistance, capacitor, etc., and a conductive pattern is formed as a thin film on a square, flat-plate substrate 1 made of alumina, and a semiconductor bare chip 4 such as transistor, etc., is wire-bonded, and then a part of the conductive pattern is exposed over the edge of the substrate 1 so as to form an earth pattern 5. An insulative protection layer 6 is potted in an area excluding the earth pattern 5 of the substrate 1, the circuit element 3 and semiconductor bare chip 4 are covered with the insulative protection layer 6, and the upper surface of the insulative protection layer 6 is flattened by a press, etc. Furthermore, a shield cover 2 made of metallic plate is adhered to the upper surface of the insulative protection layer 6 by using a conductive adhesive agent 7, and the adhesive agent 7 is also applied to the earth pattern 5, thereby connecting electrically the shield pattern 5 and earth pattern 5 by means of the adhesive agent 7. |
