| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for mounting a light emitting element, by which the light emitting element at lower cost can be provided. SOLUTION: The light emitting element 10 is formed in such a way that a semiconductor layer which is composed of a p-type semiconductor layer 11b and an n-type semiconductor layer 11c is provided, and that terminal electrodes which are installed at both end parts S11a, S11b of the semiconductor layer are provided. Further, the element is placed sideways on an electric wiring board in such a way that a P-N junction face S11c becomes perpendicular to the surface of the electric wiring board, and bonding electrodes which are installed on the electric wiring board are bonded to the terminal electrodes of the light emitting element. The size of the end parts S11a, S11b at which the terminal electrodes are installed from amount the semiconductor layer is 100 to 160μm square, and the light emitting element 10 which is placed sideways on an adhesive sheet at an adhesive strength of 200 to 300 gf/25 mm is moved on the electric wiring board so as to be placed sideways.</p> |
