| 摘要 |
PROBLEM TO BE SOLVED: To provide a scanning aligner and method that can analyze a cause where exposure line width fluctuates as quickly as possible, a controlling method and device, and a device-manufacturing method. SOLUTION: A mask stage 23 that mounts a mask M, a wafer stage 25 that mounts a wafer W, a focusing mechanism 26 that detects the surface position information of the wafer W, and adjustment means 27 and 42 that adjust the surface position of the wafer W based on the detected result of the focusing mechanism 26 are provided. Exposure light is used for allowing the pattern of the mask M to project onto the wafer W, and at the same time the wafer W and exposure light are relatively scanned for exposing an exposure region on the wafer W. A controlling method 28 is provided, where the controlling method acquires the posture information of the wafer W that is adjusted by the adjustment means 27 and 42 on exposure for storing into a memory corresponding to the surface shape information of the exposure region that is obtained in advance. By using the posture and surface shape information, it can be determined how the surface of the wafer W that is to be exposed to light has been exposed to light.
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