| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which never has the separation between an interconnection layer and a copper plating layer, or the swelling in the copper plating layer. SOLUTION: The wiring board of an insulation substrate 1 clad with an interconnection layer 2 to which electrodes of an electronic component 3 are to be connected through a connection member 5 formed of a low melting point soldering material. The surface of at least the parts of the interconnection layer 2 to which the electrodes of the electronic component 3 are to be connected through the connection member 5 is clad with a copper-phosphorus plating layer 6, copper plating layer 7, alloy layer 8 of phosphorus and at least one among palladium, platinum, rhodium, and ruthenium, and gold plating layer 8, in this order.
|
