| 摘要 |
PROBLEM TO BE SOLVED: To enhance the efficiency of probing and trimming processing for an IC chip formed on a semiconductor wafer. SOLUTION: The semiconductor wafer is charged in a probing/trimming device 3, a measured value obtained by probing the IC chip formed on the semiconductor wafer is supplied to a test device 5, converted into trimming data by the test device 5, the trimming data is supplied from the test data 5 to the probing/trimming device 3, and trimming processing is performed by the probing/trimming device 3 on the basis of the trimming data.
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