| 摘要 |
<p>The semiconductor device consists of a chip (2) forming an integrated circuit, and a connection substrate (6), with connecting points or balls (10) between the chip and substrate surfaces, distributed in the form of a matrix linked to external connectors (8). The device also incorporates at least one exchanger (14) in two sections (15,16) set at a distance from and facing one another and able to exchange signals in either direction. One of the sections is integrated in the chip and forms a component of its integrated circuit, while the other is carried by the substrate and is linked to the connectors (10). The substrate itself forms part of a wall of a housing containing the chip.</p> |
