| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package which has via holes used in common, via hole conductive parts of high reliability, and high yield, and is collectively sealed up with resin. SOLUTION: Via holes (3) for forming conduction paths between the surfaces of a double-sided copper-plated board (1) are formed in the slot form so as to be used in common by the wiring patterns of semiconductor packages, and the copper-plated board (1) is divided into the semiconductor packages along lines dividing the via holes into halves. The via hole (3) is formed in a manner in which an opening is provided to a copper-plated board (10) by etching, then a part of a board material (11) forming the opening is turned circular by laser processing, and a slot form hole is formed by successively providing a plurality of circular openings and continuously joining them together. |
