| 摘要 |
PROBLEM TO BE SOLVED: To provide a miniaturized memory card suitable for miniaturizing digital equipment. SOLUTION: External contact pads 66 are located on one line at one terminal of a memory card 50. The memory card 50 is provided with a card body 70 and a semiconductor package 60. The card body 70 is provided with a first plane 71 and a second plane, and a cavity is formed on the first plane 71. The semiconductor package 60 is provided with a substrate, at least one memory chip and a molding resin layer and mounted inside the cavity, so as to expose the external contact pads 66. On the inner surface of the substrate, circuit wiring is provided and linked electrically to the external contact pads 66 formed on the outer surface of the substrate. |
