SIMULATED DEFECT WAFER AND METHOD FOR FORMING DEFECT INSPECTION RECIPE

摘要

PROBLEM TO BE SOLVED: To provide a method for forming independently of a proficiency of a former an optimum defect inspection recipe whereby all kinds of defects can be detected. SOLUTION: A temporary inspection recipe is formed with the use of the simulated defect wafer 1 including simulated defect patterns DF1-DF3 having a change in a height direction and a change in a plane shape to a simulation normal pattern. Defect inspection of the simulated defect wafer 1 is carried out. Detected defect data are compared with preliminarily obtained simulated defect data of the simulated defect wafer 1 to quantify a defect detection sensitivity. Recipe parameters are changed until a desired defect detection rate is obtained. The temporary inspection recipe is thus formed.