| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonding apparatus where an electronic component can be implemented on a metal stem automatically. SOLUTION: In a die bonding apparatus 1 for implementing an electronic component S on a metal stem 2, the die bonding apparatus 1 is configured so as to comprise a bonding nozzle 17 for sucking the electronic component S and placing the electronic component S on a component side 27 of the stem 2, a stem mounting head 6 for making the stem 2 mount, a heater part 9 for heating in a state that the electronic component S is arranged on the component side 27 of the stem 2, and an imaging camera 12 that has an optical axis L extending so as to pass through the component side 27 of the stem 2 arranged in the heater part 9 and reciprocate in line with the direction of the optical axis L. |
