METHOD FOR CUTTING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To prevent a damage of each of electrodes provided on upper and lower surfaces of a substrate. SOLUTION: A method for cutting the substrate comprises the steps of coating adhesives 3 and 6 on the upper and lower surfaces of the substrate 4 having electrodes 4c on the upper and lower surfaces, then adhering the substrate 4 onto a stationary plate 2 by using the adhesive 3 of its lower surface side, and thereafter cutting the substrate 4 by a cutting means so as to arrive from the adhesive 6 side of the upper surface at the lower plate 2.