CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a method of mounting an electronic component on electrodes formed on a substrate, wherein a conductive adhesive is used and a connection reliability between the electrodes of the substrate and the terminals of the electronic component can be increased. SOLUTION: The terminals 4 of the electronic component are formed in such a shape as to have a long side direction and a short side direction. The terminals 4 are disposed with the long side direction directed toward the center of the electronic component.