| 摘要 |
PROBLEM TO BE SOLVED: To inexpensively provide a small-sized large-capacitance chip-like capacitor. SOLUTION: In this chip-like capacitor composed of a conductive adhesive layer which electrically connects a capacitor element having lead-out leads to electrode substrates which become the electrodes of the capacitor, the electrode substrates are formed in such a way that, after at least two conductive plates are coated with an insulating resin, the resin is removed from conductive adhesive layer connecting sections and external electrodes sections on the conductive plates, and plated layers are formed in the removed sections.
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