| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed board having terminals with high contact reliability without thickening a gold plated layer. SOLUTION: Plating treatment in the terminal part 1 of a printed board 50 is performed by a stage in which nickel-boron plating is applied on a stock part 10 and a stage in which gold plating is applied on the surface of the nickel- boron plated layer 20 formed by the same stage. In this way, the local battery action in a region A is made hard to occur, and the corrosion of the nickel- boron plated layer 20 can be prevented.
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