| 摘要 |
PURPOSE: To inspect minute device patterns by inspecting images with a low resolution which are picked up by a visible light image pickup means when an object to be inspected is illuminated with a visible light, and processing and analyzing images with a high resolution which are picked up by an ultraviolet light image pickup means when the object is illuminated with an ultraviolet light. CONSTITUTION: An optical unit 12 has a function of picking up images of a semiconductor wafer to be inspected with a low resolution with the use of a visible light, and a function of picking up images of the semiconductor wafer with a high resolution with the use of an ultraviolet light. The image of the semiconductor wafer illuminated with the visible light is enlarged by an objective lens 36 for visible light, and picked up by a CCD camera 32 for visible light. The image of the semiconductor wafer illuminated with the ultraviolet light is enlarged by an objective lens 40 for ultraviolet light and picked up by a CCD camera 33 for ultraviolet light. Images picked up by the CCD cameras 32 and 33 are taken into a computer 30 for image processing. First the image picked up by the camera 32 is processed and analyzed to carry out the low-resolution inspection. Then the image picked up by the camera 33 is processed and analyzed to carry out the high-resolution inspection.
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